Apparatus for grinding semiconductor wafer

Details Apparatus for grinding semiconductor wafer Apparatus for grinding semiconductor wafer

B - Operations, Transporting

24

B

51/81

B24B 57/02 (2006.01) B24B 7/22 (2006.01) B24B 37/04 (2006.01) B24B 55/02 (2006.01)

Patent

CA 2012878

This invention relates to an apparatus for grinding a semiconductor wafer which includes a table having a work stage on which a semiconductor wafer to be ground is placed, at least the work stage being rotated, and a grinding wheel which is moved in a direction perpendicular to or parallel to the work stage while being rotated about an axis parallel to a rotational axis of the work stage. In this apparatus, a semiconductor wafer is cooled during grinding. In order to perform cooling, the apparatus has an inlet flow path for guiding cooling liquid to a grinding surface of the semiconductor wafer, and an outlet flow path for collecting the cooling liquid flowed onto the work stage. The apparatus also includes temperature detector, arranged in the outlet flow path, for detecting a temperature of the recovered cooling liquid. A rotational speed of the grinding wheel or the rotary table is controlled based on the temperature of the cooling liquid detected by the temperature detector.

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