Apparatus for heat removal from a pc card array

H - Electricity – 05 – K

Patent

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Details

H05K 7/20 (2006.01)

Patent

CA 2210111

An apparatus for cooling an array of PC cards includes a chassis defining a chamber having air holes. A heat sink is mounted to the chassis within the chamber and has a finned surface for transferring heat to the surrounding environment, a finless surface on a side opposite the finned surface, and heat pipes fully enclosed within the heat sink, facilitating conductive heat transfer between the finned and finless surfaces. A backplane mounted to the chassis has at least one connector mechanically and electrically connectable to at least one PC card so that a surface of the at least one PC card is in close proximity to and substantially parallel to the finless surface of the heat sink thus facilitating heat transfer between the at least one PC card and the heat sink.

L'invention porte sur un appareil pour refroidir un réseau de cartes à PC comprenant un boîtier définissant une chambre comportant des trous d'évent. Un dissipateur thermique est monté sur le boîtier à l'intérieur de la chambre et comporte une surface à ailettes permettant de transférer la chaleur au milieu environnant, une surface sans ailette sur un côté opposé à la surface à ailettes, et des caloducs complètement enfermés dans le dissipateur, ce qui facilite le transfert de chaleur par conduction entre la surface à ailettes et celle sans ailette. Un panneau arrière monté sur le boîtier comporte au moins un connecteur pouvant être relié mécaniquement et électriquement à au moins une carte à PC, de sorte qu'une surface de cette dernière est placée parallèle à la surface sans ailette du dissipateur thermique et à proximité de celle-ci, ce qui facilite le transfert thermique entre la carte à PC et le dissipateur thermique.

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