Apparatus for laser cuting material

Details Apparatus for laser cuting material Apparatus for laser cuting material

B - Operations, Transporting

23

K

B23K 26/32 (2006.01) A61F 2/24 (2006.01) B23K 26/40 (2006.01)

Patent

CA 2666665

A method of cutting material for use in an implantable medical device employs a plotted laser cutting system. The laser cutting system is computer controlled and includes a laser combined with a motion system. The laser precisely cuts segments out of source material according to a predetermined pattern as designated by the computer. The segments are used in constructing implantable medical devices. The cutting energy of the laser is selected so that the cut edges of the segments are melted to discourage delamination or fraying, but communication of thermal energy into the segment beyond the edge is minimized to avoid damaging the segment adjacent the edge.

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