Apparatus for mounting components on a substrate

Details Apparatus for mounting components on a substrate Apparatus for mounting components on a substrate

B - Operations, Transporting

23

K

26/24

B23K 31/00 (2006.01) H05K 13/04 (2006.01)

Patent

CA 1136834

APPARATUS FOR MOUNTING ELECTRONIC COMPONENTS ON A SUBSTRATE ABSTRACT OF THE DISCLOSURE An improved component engaging apparatus mounts electrical and electronic chip components or the like on a circuit board or substrate. A unit applies a bonding agent to the substrate and a chip component mounting section mounts the components on the bonding agent on the substrate. A component feeding section sequentially feeds the components. A driving section operates the component feeding section, and a substrate support section is arranged to alter its position with respect to the component mounting section and the bond- ing agent applying section.

347037

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