Apparatus for mounting electronic components

Details Apparatus for mounting electronic components Apparatus for mounting electronic components

H - Electricity

01

L

26/24

H01L 21/58 (2006.01) H05K 13/04 (2006.01)

Patent

CA 1126936

ABSTRACT OF THE DISCLOSURE An apparatus for mounting electronic components on a printed board substrate comprises a component feeder for sequentially feeding the electronic components in an aligned row, a chuck which receives and rectifies by pinching the position of the electronic components, a vertically movable mounting head, which holds by air suction one of the electronic components preliminarily pinched and rectified of the position by the chuck, and goes down through a wide open gap of the chuck to mount the electronic component on an accurate position of the substrate.

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