Apparatus for peeling semiconductor substrate

Details Apparatus for peeling semiconductor substrate Apparatus for peeling semiconductor substrate

H - Electricity

01

L

H01L 21/70 (2006.01) H01L 21/00 (2006.01) H01L 21/02 (2006.01) H01L 21/30 (2006.01)

Patent

CA 2067027

Abstract of the Disclosure There is disclosed an apparatus for peeling a semiconductor substrate includes an unit for fixing a reinforcing plate bonded to the semiconductor substrate , a mechanism for pushing the semiconductor substrate bonded to the reinforcing plate in a direction parallel to a bonding surface, an unit for monitoring a stress generated by the semiconductor substrate, and a controller for controlling a driving unit of the pushing mechanism of the semiconductor substrate in accordance with the monitored stress.

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