Apparatus for placing chip type circuit elements on a board

H - Electricity – 01 – L

Patent

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Details

356/194

H01L 21/70 (2006.01) H05K 13/04 (2006.01)

Patent

CA 1137652

ABSTRACT OF THE DISCLOSURE An apparatus for placing chip type circuit elements, wherein the elements are supplied from a hopper and are laterally turned for placing the circuit elements on a template. The apparatus includes an accommodating member for temporarily storing circuit elements, a movable shutter member placed under the accommodating member so that the circuit elements in the accommodating member can be laterally turned, and a template member placed under the shutter member to receive the circuit elements dropped from the accommodating member when the shutter member is removed. The invention further discloses a method of bonding circuit elements placed on the template member onto a printed circuit board.

348984

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