Apparatus for preforming wire leads and alignment for bonding

Details Apparatus for preforming wire leads and alignment for bonding Apparatus for preforming wire leads and alignment for bonding

H - Electricity

02

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H02G 1/14 (2006.01) B23K 20/10 (2006.01) H01L 21/00 (2006.01) H01L 21/60 (2006.01) H01L 21/607 (2006.01)

Patent

CA 1037237

APPARATUS FOR PREFORMING WIRE LEADS AND ALIGNMENT FOR BONDING Abstract of the Disclosure In an apparatus for preforming the ends of wire leads of lead frames, prior to bonding, the lead frames are fed successively through a preforming position. A positioning and alignment device is provided correctly positioning the lead frames prior to preforming, the device using as datum surfaces, surfaces used to position the lead frames during manufacture. Typically the lead frames are produced on perforated strip film and the perforations act as positioning datum surfaces during manufacture and during preforming. After preforming the lead frames are fed to a bonding position for automatic bonding, as by an ultrasonic wobble bonding tool. - i -

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