Apparatus for rapid plasma treatments and method

Details Apparatus for rapid plasma treatments and method Apparatus for rapid plasma treatments and method

C - Chemistry, Metallurgy

23

C

C23C 16/54 (2006.01) B05D 3/14 (2006.01) C23C 16/40 (2006.01) C23C 16/50 (2006.01) H01J 37/32 (2006.01) H05H 1/24 (2006.01)

Patent

CA 2119561

A plasma treating apparatus is useful for coating substrates with thin films having vapor barrier properties at relatively rapid deposition rates. The apparatus comprises an evacuable chamber, an electrically powered electrode defining a plasma-fac- ing surface within the chamber; and a shield spaced a distance .DELTA. transverse to the plasma-facing surface. During plasma treat- ments, the plasma is confined to within distance .DELTA. while a substrate is continuously fed through the confined plasma.

Affiliated with

Also associated with

Rating

Apparatus for rapid plasma treatments and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for rapid plasma treatments and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for rapid plasma treatments and method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1874135