Apparatus for reacting semiconductor wafer with steam

Details Apparatus for reacting semiconductor wafer with steam Apparatus for reacting semiconductor wafer with steam

H - Electricity

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356/187

H01L 21/46 (2006.01) C04B 41/50 (2006.01) C04B 41/87 (2006.01) C23C 8/16 (2006.01) C30B 33/00 (2006.01) F22B 27/00 (2006.01)

Patent

CA 1209724

-15- Abstract of the Disclosure An apparatus for reacting a semiconductor wafer with steam includes a reaction tube and a heater for heating the reaction tube. The reaction tube is divided into three chambers by partition plates having a through hole. Pure water is directly supplied into the most upstream chamber and is evaporated into steam. The steam enters the second chamber and further heated therein into superheated steam. The superheated steam enters the most downstream chamber in which a semi- conductor wafer or wafers are placed, and is heated sufficiently for reaction with the wafer to form an oxide film thereon.

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