Apparatus for redundant cooling of electronic devices

H - Electricity – 05 – K

Patent

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H05K 7/20 (2006.01) G06F 1/20 (2006.01) G06F 11/20 (2006.01)

Patent

CA 2099032

An enclosure for heat generating electronic components establishes an airflow path for cooling air. Air is forced through the enclosure by powered air movers, one of which is mounted at the air inlet to the enclosure, and the other of which is mounted at the outlet. Preferably only one air mover is used at a time. In the event of failure of the air mover being used, the remaining air mover begins operation. The total cooling airflow passes through both air movers, and thus the air movers may thus be said to be arranged in series with respect to the airflow. Because the air movers are mounted in series with respect to the airflow, the airflow pattern is substantially the same regardless of which air mover is currently operating. Thus, hot spots which may result when one fan in a fan bank fails are avoided. In the preferred embodiment, the enclosure houses a redundant array of independent disks (RAID) of a computer system. In an alternative embodiment, air movers arranged serially with the airflow can be used to provide additional cooling for severe operating conditions.

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