Apparatus for separating semiconductor chips

Details Apparatus for separating semiconductor chips Apparatus for separating semiconductor chips

H - Electricity

01

L

356/191

H01L 21/00 (2006.01) B28D 5/00 (2006.01)

Patent

CA 1311314

- 1 - Abstract: An apparatus for making a semiconductor device by individually separating semiconductor chips formed on a wafer, comprises a flexible mat, support shafts for supporting the mat in a substantially horizontal position, and a pressing plate having a generally convex body and being supported for movement up and down. A drive mechanism vertically moves the pressing plate and the wafer relative to one another. The wafer has first and second surfaces opposite each other, with the chips formed on the first surface. The wafer is placed on the mat with the chips confronting the mat. The convex body of the pressing plate is pressed against the second surface of the wafer to separate the chips on the wafer. The apparatus simplifies the process and avoids damaging the chips.

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