Apparatus for soldering solder on ceramic substrate

Details Apparatus for soldering solder on ceramic substrate Apparatus for soldering solder on ceramic substrate

H - Electricity

05

K

356/193, 327/84

H05K 3/34 (2006.01) B23K 1/06 (2006.01)

Patent

CA 1147481

ABSTRACT OF THE DISCLOSURE An apparatus for applying solder to a difficultly solderable substrate comprising a vibration tip which is rotatably mounted on an ultrasonic oscillation mechanism and is slidable in the vertical direction. A needle is placed at a predetermined distance and in a predetermined direction from the edge of said vibration tip and said needle projects to sub- stantially the same level as that of said edge of said vibration tip.

358075

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