Apparatus for the application of thin layers to a substrate...

Details Apparatus for the application of thin layers to a substrate... Apparatus for the application of thin layers to a substrate...

C - Chemistry, Metallurgy

23

C

204/167

C23C 14/38 (2006.01) C23C 14/00 (2006.01) H01J 37/34 (2006.01) H01L 21/285 (2006.01) C23C 14/35 (2006.01)

Patent

CA 1321772

ABSTRACT OF THE DISCLOSURE An apparatus is disclosed for the application of a thin- layer on a substrate by means of a cathode sputtering process. The apparatus includes a mechanical shutter provided between a cathode to be sputtered and an anode. The shutter, provided with an opening, divides the space between the cathode and the substrate to be coated. In addition, a glow discharge is provided between the sputtering cathode and the shutter as well as between the anode and the shutter where the gas mixture is introduced.

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