Apparatus for the coating of flat-form substrates,...

H - Electricity – 05 – K

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H05K 13/00 (2006.01) H05K 3/00 (2006.01)

Patent

CA 2286017

An apparatus for the coating of flat-form substrates, especially of printed circuit boards, solder masks and the like, wherein there is arranged between two coating stations a turning station for the printed circuit boards, which are conveyed on a transporter pathway through the coating stations and the turning station, wherein in the turning station (4) there are provided in the same plane as the incoming transporter pathway (2) receiving elements (5) located, spaced apart, opposite one another, which enter into engagement with the edge of a printed circuit board (11) or a holding element attached to the printed circuit board, it being possible to pivot those receiving elements (5) through 180~ so that, when the printed circuit board is discharged, they again lie in the plane of the onwards-leading transporter pathway (2').

Dispositif servant à effectuer le revêtement de substrats de forme plate, en particulier, des cartes de circuits imprimés ou des masques de soudure, par exemple, dans lequel est situé entre deux stations de revêtement, une station de rotation pour les cartes de circuits imprimés transportées sur un trajet de transport à travers les stations de revêtement et la station de rotation (4). Dans cette dernière, des éléments de réception (5) éloignés l'un de l'autre et opposés l'un à l'autre, sont situés dans le même plan que le trajet de transport d'arrivée (2) et viennent en contact avec le bord d'une carte de circuits imprimés (11) ou d'un élément de support fixé à la carte de circuits imprimés, ces éléments de réception (5) pouvant pivoter à 180·, de manière à se trouver à nouveau dans le plan du trajet de transport vers l'avant (2') quand la carte de circuits imprimés est évacuée.

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