Apparatus with interconnection arrangement

G - Physics – 01 – R

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G01R 1/04 (2006.01) B29C 37/00 (2006.01) B29C 70/72 (2006.01) H01F 27/02 (2006.01)

Patent

CA 2100146

An electrical path or interconnection arrangement is provided within a formed support body of polymeric material that exhibits volumetric changes during and after the forming thereof. The electrical path or interconnection arrangement provides an accurately positioned electrically conductive path through the material of the support body and also responds to, accommodates and alleviates the effects of forces at the interface between the material of the support body and the electrical path or interconnection arrangement that occur during and after the forming of the support body. The interconnection arrangement exhibits predetermined deformability/compressibility characteristics to alleviate stresses caused by the volumetric changes of the polymeric material. In a preferred arrangement, the interconnection arrange- ment includes an elongated tubular conductor fabricated from a metallic material. The material, the thickness of the tubular walls of the conductor, and the dimensions of the cross- section of the conductor are selected in accordance with the dimensions of the electrical path and the characteristics of the polymeric material to provide predetermined deform- ability/compressibility characteristics so as to avoid undesirable stress at the interface of the conductor and the polymeric material. In a specific embodiment, the interconnection arrange- ment also provides for the grading of the electrical field about a terminal conductor via the provision of a resilient member that is disposed about the terminal conductor and also connects one end of a conductor of the interconnection arrangement to the terminal conductor.

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