Application of film adhesive for post mold application

Details Application of film adhesive for post mold application Application of film adhesive for post mold application

B - Operations, Transporting

29

D

B29D 35/12 (2010.01) A43B 13/12 (2006.01) C09J 5/00 (2006.01)

Patent

CA 2544102

The method of preparing a sole assembly intended to be attached to a shoe upper and/or midsole. A coat of primer is applied to a molded shoe sole and then conditioned. A film adhesive is pressed on to the primer coated surface of the sole under pressure. The primer may be dried before applying the adhesive film. The sole is conditioned at 40-90°C for approximately 30-60 seconds and heat pressed at 40-90°C at 40-70 psi for 5-30 seconds.

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