B - Operations – Transporting – 05 – D
Patent
B - Operations, Transporting
05
D
117/100, 204/91.
B05D 3/06 (2006.01) H05K 3/00 (2006.01) H05K 3/28 (2006.01)
Patent
CA 1198082
-1- Abstract A process for applying a patterned coating to a circuit board without the use of a patterning mask. A surface of the circuit board is coated with uncured material having a cure reaction which is inhibited by the presence of oxygen. The thickness of the material on land areas surrounding holes through the circuit board is reduced by causing a portion of the material to flow into the holes. The material is then exposed, in the presence of oxygen, to an energy source which advances the cure reaction only of sublayers of the material which are isolated from the oxygen by overlayers of the material. Surface layers of the material, including substantially the entire thickness of the reduced thickness portions of the layer, remain uncured, allowing subsequent selective removal of the uncured portions of the material.
415672
Kirby Eades Gale Baker
Western Electric Company Incorporated
LandOfFree
Applying coating to circuit board spaced from hole edges and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Applying coating to circuit board spaced from hole edges and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Applying coating to circuit board spaced from hole edges and... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1213285