Applying flux to a solder wave for wave soldering an element

Details Applying flux to a solder wave for wave soldering an element Applying flux to a solder wave for wave soldering an element

B - Operations, Transporting

23

K

B23K 1/00 (2006.01) B23K 1/08 (2006.01) B23K 1/20 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2158821

An arrangement of applying flux in solid, liquid or gaseous form directly to the solder wave avoids prefluxing of printed circuit boards or other elements to be soldered or solder wetted. The process for wave soldering an element comprises the steps of forming a solder wave above a solder reservoir, applying a flux directly to the solder wave separately from a shield gas delivery means to blanket the solder wave, and conveying the element through at least a portion of the solder wave. The process is applicable to wave soldering under a shroud wherein a gas shield is supplied by diffusers under the shroud, the flux being applied by at least one gas applicator directly to the solder wave.

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