C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
204/36
C25D 3/38 (2006.01)
Patent
CA 1038326
NOVEL PROCESSES AND COMPOSITIONS Abstract of the Disclosure - In accordance with certain of its aspects, this invention relates to novel compositions and to a process for electrodepositing bright, strongly leveled, ductile copper from an aqueous acidic copper plating bath containing chloride ions and at least one member independently selected from each of the following groups: (A) a polysulfide compound of the formula Image ; (B) a heterocyclic sulfur compound containing the grouping Image and/or tautomers thereof, where the nitrogen atom and the two carbon atoms are part of a heterocyclic ring; and (C) a polyether containing at least 5 ether oxygen atoms per molecule; wherein R is independently a divalent aliphatic or aromatic non-heterocyclic group of 1 - 10 carbon atoms; R' is hydrogen, a metal cation, a monovalent aliphatic or aromatic group of ( i ) 1 - 20 carbon atoms, or the groups -R-SO3M or -R-(S)q-RSO3M wherein q is an integer 2-5; M is a cation; Z is 0 or 1; R" is hydrogen, a metal ion or one of the groups Image , Image , Image where R"' is hydrogen, an alkyl group of 1 - 6 carbon atoms, aryl, alkaryl or aralkyl group. ( ii )
172595
Arcilesi Donald A.
Kardos Otto
Valayil Silvester P.
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