Aqueous, acidic solution and method for electrolytically...

C - Chemistry – Metallurgy – 25 – D

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C25D 3/38 (2006.01)

Patent

CA 2532445

The aqueous acidic solution for electrolytically depositing high polish, decorative bright, smooth and level copper coatings on large area metal or plastic parts contains a) at least one oxygen-containing, high molecular additive and b) at least one water soluble sulfur compound, wherein the solution additionally contains c) at least one aromatic halogen derivative having the general formula (I), wherein R1, R2, R3, R4, R5 and R6 are each independently radicals selected from the group comprising hydrogen, aldehyde, acetyl, hydroxy, hydroxyalkyl having 1 - 4 carbon atoms, alkyl having 1 - 4 carbon atoms and halogen, with the proviso that the number of residues R1, R2, R3, R4, R5 and R6 which are halogen ranges from 1 to 5.

L'invention concerne une solution aqueuse acide de dépôt électrolytique de revêtements de cuivre à polissage brillant, décoratif, lisse et égalisé sur des pièces métalliques ou en plastique de grande dimension, contenant a) au moins un additif hautement moléculaire contenant de l'oxygène, et b) au moins un composé de soufre soluble dans l'eau, ladite solution contenant également c) au moins un dérivé halogène aromatique représenté par la formule générale (I), dans laquelle R¿1?, R¿2?, R¿3?, R¿4?, R¿5? et R¿6? sont chacun indépendamment des radicaux sélectionnés dans le groupe comprenant l'hydrogène, l'aldéhyde, l'acétyle, l'hydroxy, un hydroxyalkyle comprenant de 1 à 4 atomes de carbone, un alkyle comprenant de 1 à 4 atomes de carbone et un halogène, à condition que le nombre de restes R¿1?, R¿2?, R¿3?, R¿4?, R¿5? et R¿6? formés d'halogène varie de 1 à 5.

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