C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
400/1603, 400/58
C09J 179/02 (2006.01)
Patent
CA 1263983
ABSTRACT OF THE DISCLOSURE An aqueous adhesive composition which comprises 0.5 to 30 parts by weight, as solids, of an aqueous cationic polyamide polyamine epichlorohydrin resin solution per 100 parts by weight, as solids, of an aqueous, cationic or nonionic polymer dispersion can demonstrate not only excellent water resistance in spite of their room-temperature drying type, when applied to various kinds of substrates but also exceptionally improved storage stability.
469555
Kato Akira
Minamida Hisatsugu
Sawayama Isamu
Tanaka Ken-Ichi
Fetherstonhaugh & Co.
Takeda Chemical Industries Ltd.
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