C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
C08K 3/36 (2006.01) C08L 11/02 (2006.01) C09J 11/02 (2006.01)
Patent
CA 2488717
The present invention provides a method for bonding substrates comprising coating a surface of each substrate with an aqueous polymer dispersion and joining the surfaces. The dispersion comprises dispersed polychloroprene particles having an average particle diameter of from 60 to 220 nm and dispersed silicon dioxide particles having an average SiO2 particle diameter of from 1 to 400 nm.
L'invention concerne une dispersion polymère aqueuse à base de polychloroprène, des procédés de réalisation associés et une utilisation de cette dispersion.
Musch Rudiger
Panskus Knut
Pantke Dietrich
Bayer Materialscience Ag
Norton Rose Or S.e.n.c.r.l. S.r.l./llp
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