Aqueous alkaline bath for the chemical deposition of copper

Details Aqueous alkaline bath for the chemical deposition of copper Aqueous alkaline bath for the chemical deposition of copper

C - Chemistry, Metallurgy

23

C

6/4, 117/77

C23C 18/34 (2006.01) C23C 18/40 (2006.01)

Patent

CA 1254353

ABSTRACT OF THE DISCLOSURE This invention provides an aqueous alkaline bath for the adhesive chemical deposition of highly pure copper, contain- ing compounds of copper, reducing agents, welting agents, pH reg- ulators, stabilizers, inhibitors and complexing agents, as well as sorbitol or glycerin in mixture with bluret as the complexing agents, as well as a process using this bath, in par- ticular for the manufacture or printed circuit boards.

473446

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