C - Chemistry – Metallurgy – 09 – K
Patent
C - Chemistry, Metallurgy
09
K
166/16, 31/21
C09K 8/575 (2006.01) C09K 8/508 (2006.01)
Patent
CA 1077701
ABSTRACT OF THE DISCLOSURE An aqueous based slurry is disclosed containing an aqueous carrier fluid, an epoxy resin, a curing agent for the resin, a solvent for said resin and curing agent, a finely divided particulate material, a particular quater- nary ammonium halide, and a coupling agent to promote bonding of the resin to the particulate. Optionally, the slurry may contain a thickening or gelling agent for the water to enhance its solids carrying capacity and an agent to break the gel after its purpose has been served. The slurry, suitable for use in placing a permeable, consolidated gravel pack adjacent an incompetent subterranean formation, is characterized in that it does not require an oil-based carrier and also in that it can easily be prepared in the field by adding the particulate directly to the aqueous carrier without precoating the particulate with the resin.
288102
Constien Vernon G.
Copeland Claude T.
Na
The Dow Chemical Company
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