C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/5045, 400/70
C08L 75/02 (2006.01) C08C 19/40 (2006.01) C08F 8/30 (2006.01) C08G 59/50 (2006.01) C08G 65/333 (2006.01) C09D 5/44 (2006.01) C09D 175/02 (2006.01)
Patent
CA 2006849
- 27 - ABSTRACT Disclosed is a novel curing system which is not associated with decomposition or production of low molecular materials. The curing system employs aqueous composition which comprises (a) a compound having in one molecule at least two carbonylcyclic urea groups represented by the following formula (1); Image (1) [wherein n is an integer of 0 to 5, X which may be the same or different represents oxygen atom, a sulfur atom or -NR1- in which R1 is a hydrogen atom, an alkyl, hydroxyalkyl or alkylene group having 1 to 5 carbon atoms.] and (b) a basic resin which has a functional group reactive with an isocyanate group and is water soluble or water dispersible by neutralizing. The present invention also provides an aqueous composition comprising a basic resin (c) which has a functional group reactive with an isocyanate group and has in one molecule at least two carbonylcyclic urea groups represented by the following formula (1); Image (1) - 28 - [wherein n and X are the same as mentioned above.] and which is water soluble or water dispersible by neutralizing.
Sakamoto Hiroyuki
Tobinaga Kenshiro
Tsuboniwa Noriyuki
Tsuchiya Yasuyuki
Umemeto Hirotoshi
Kirby Eades Gale Baker
Nippon Paint Co. Ltd.
Sakamoto Hiroyuki
Tobinaga Kenshiro
Tsuboniwa Noriyuki
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