Aqueous compositions containing overbased materials

C - Chemistry – Metallurgy – 10 – M

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253/133, 134/47

C10M 173/00 (2006.01) C09K 8/06 (2006.01)

Patent

CA 1206058

ABSTRACT OF THE DISCLOSURE An aqueous composition comprising: (A) water; (B) an overbased material dispersed with component (A), said overbased material being selected from the group consisting of (B)(I) a Newtonian overbased material or (B)(II) a non-Newtonian colloidal disperse system comprising (1) solid metal-containing colloidal particles predispersed in (2) a disperse medium of at least one inert organic liquid and (3) as an essential third component at least one member selected from the class consisting of organic compounds which are substantially soluble in said disperse medium, the molecules of said organic compound being characterized by polar substituents and hydro- phobic portions; and an effective amount of at least one additional com- ponent to disperse component (B) with component (A), said additional component being selected from the group consisting of (C) at least one nitrogen-containing, phosphorus-free carboxylic solubilizer made by the reaction of (C)(I) at least one carboxylic acid acylating agent having at least one hydrocarbon-based substituent of about 12 to about 500 carbon atoms with (C)(II) at least one (a) N-(hydroxyl-substituted hydrocarbyl) amine, (b) hydroxyl-substituted poly(hydrocarbyloxy) analog of said amine or (c) mix- ture of (a) and (b), (D) at least one surfactant, or (E) mixture of (C) and (D).The foregoing aqueous compositions are optionally provided in combination with (F) a functional additive and/or (G) a dispersion enhancer selected from the group consisting of polyhydroxy compounds and partial ethers of polyhydroxy compounds. A method for cutting hard materials such as quartz, silicon and the like utilizing the foregoing compositions, as well as abrasive slurries for said cutting method and for conventional lapping applications and for metal working or polishing applications is provided.

419286

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