Aqueous dispersions of epoxy resins and a process to prepare...

C - Chemistry – Metallurgy – 08 – L

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C08L 71/02 (2006.01) C08J 3/07 (2006.01) C08J 3/24 (2006.01) C08L 63/00 (2006.01)

Patent

CA 2337389

A process to provide an aqueous dispersion comprising the steps of: a) emulsifying a mixture comprising: i) water, ii) at least one epoxy resin having a functionality of greater than 0.8 epoxide group per molecule, iii) from 0.1 to 20 weight percent, based on the epoxy resin, of at least one polyoxyalkylene surfactant, and iv) optionally an acetone-free solvent solution to produce a resin-surfactant emulsion; and b) adding a solvent mixture to said resin-surfactant emulsion, said solvent mixture comprising: i) acetone; and ii) a non-volatile hydrophobic liquid resin or resin modifier to produce the aqueous dispersion; improved aqueous dispersions and curable compositions and cured products derived therefrom.

L'invention concerne un procédé permettant de préparer une dispersion aqueuse. Ce procédé consiste: (a) à émulsionner un mélange contenant (I) de l'eau, (II) au moins une résine époxyde dont la fonctionnalité est supérieure à 0,8 groupes époxydes par molécule, (III) entre 0,1 et 20 % en poids, en fonction de la résine époxyde, d'au moins un tensioactif polyokyalkylène et (IV) éventuellement d'une solution de solvant sans acétone pour produire une émulsion tensioactive de résine; et (b) à ajouter un mélange de solvant à ladite émulsion tensioactive de résine; ledit mélange de solvant contient (I) de l'acétone, (II) une résine liquide hydrophobe non volatile ou un adjuvant résineux pour produire la dispersion aqueuse. L'invention concerne également des dispersions aqueuses améliorées ainsi que des compositions durcissables et des produits durcis dérivés de ces dispersions.

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