Aqueous electroless nickel plating bath and process

Details Aqueous electroless nickel plating bath and process Aqueous electroless nickel plating bath and process

C - Chemistry, Metallurgy

23

C

6/5, 117/78

C23C 18/34 (2006.01) C23C 18/36 (2006.01)

Patent

CA 1225501

ABSTRACT OF THE DISCLOSURE An improved aqueous electroless nickel plating bath and process for chemically depositing nickel on a substrate comprising an aqueous solution containing nickel ions, hypophosphite ions, a complexing agent, preferably a buffering agent and a wetting agent, and a small but effective amount of a sulfonium betaine compound sufficient to control the rate of nickel deposition and the concentration of phosphorus in the nickel deposit, preferably, in further combination with supplemental organic and/or inorganic rate stabilizers. The invention further contemplates a process for rejuvenating an electroless nickel bath which has been rendered inoperative due to the presence of excessive concentrations of supplemental stabilizing agents by the addition of a controlled effective amount of a sulfonium betaine compound sufficient to restore the bath to an operative plating condition.

458433

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