Aqueous electroplating bath and method for electroplating...

Details Aqueous electroplating bath and method for electroplating... Aqueous electroplating bath and method for electroplating...

C - Chemistry, Metallurgy

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C25D 3/32 (2006.01) B01F 17/00 (2006.01) C25D 3/36 (2006.01) C25D 3/60 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1308057

ABSTRACT OF THE DISCLOSURE Tin, lead or tin-lead alloy electroplating baths producing little or no foam during electroplating, even at conditions of high-speed plating using high current densities and or vigorous bath circulation, are disclosed comprised of tin and/or lead salts of alkane sulfonic acids, free alkane sulfonic acid, brightening agent, a defoaming agent comprised of silicone and silica and/or a silicate in polypropylene glycol, a first nonionic surfactant consisting of an ethoxylated arylphenol and a second nonionic surfactant consisting of an ethoxylated short-chain alcohol.

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