C - Chemistry – Metallurgy – 09 – D
Patent
C - Chemistry, Metallurgy
09
D
C09D 163/00 (2006.01) B32B 15/08 (2006.01) C08G 59/18 (2006.01) C08G 59/50 (2006.01) C09J 5/02 (2006.01) C09J 163/00 (2006.01)
Patent
CA 2144547
Aqueous primer compositions containing substantially no volatile organic solvents, suitable for promoting the bonding of a metal adherend to a second adherend, are prepared by dispersing one or more solid epoxy resins and a solid curing agent into water such that the particle sizes of the solids are less than 30 µm. The primer compositions are environmentally superior to sol- vent based primers without loss of physical properties, are storage stable, and exhibit excellent solvent resistance.
Cytec Technology Corp.
Smart & Biggar
LandOfFree
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