Aqueous photosensitive resin composition and print obtained...

Details Aqueous photosensitive resin composition and print obtained... Aqueous photosensitive resin composition and print obtained...

G - Physics

03

F

G03F 7/038 (2006.01) G03F 7/033 (2006.01) H05K 3/06 (2006.01)

Patent

CA 2072702

ABSTRACT OF THE DISCLOSURE An aqueous-based photosensitive resin for the production of printed circuit boards is disclosed.

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