Aqueous process for etching copper and other metals

Details Aqueous process for etching copper and other metals Aqueous process for etching copper and other metals

C - Chemistry, Metallurgy

23

F

149/14

C23F 1/18 (2006.01) C23F 1/12 (2006.01) C23F 1/16 (2006.01) H05K 3/06 (2006.01)

Patent

CA 1221896

ABSTRACT Nitrogen dioxide process for etching copper and other metals, using water as a catalyst/solvent. In one disclosed embodiment, a film of water is formed on the surface of the metal, and the water-covered metal is exposed to gaseous NO2 to dissolve the metal. In another embodiment, the metal is exposed to an aqueous solution of NO2 or HNO3 in water, either by immersion or by spraying, to remove the metal.

453433

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