C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/1200, 261/49
C08L 89/00 (2006.01) C04B 28/02 (2006.01) C08J 3/12 (2006.01) C08K 5/54 (2006.01) C09D 7/12 (2006.01)
Patent
CA 1296460
AQUEOUS REDISPERSIBLE POWDERS WHICH CONTAIN A WATER-SOLUBLE POLYMER AND AT LEAST ONE ORGANIC SILICON COMPOUND AND A PROCESS FOR PREPARING THE SAME Abstract of the Disclosure Aqueous redispersible powders which contain a water- soluble polymer and at least one organic silicon compound, in which at least 50 percent by weight of the organic silicon compound(s) used to prepare these powders are liquid or solid at room temperature at 1,020 hPa (abs.), have a boiling point of at least 150°C at 1,020 hPa (abs.), and contain an average of not more than 1.8 SiC-bonded organic radicals per silicon atom, and have at least one hydrogen atom bonded directly to silicon per molecule, or at least one hydroxy group bonded to silicon per molecule, or at least one hydrocarbon radical bonded to silicon via oxygen per molecule which may be substi- tuted by an alkoxy group, or a mixture of at least two such condensable substituents in which the organic silicon compound(s) are used in an amount of at least 30 percent by weight, based on the total weight of the powder (calculated as anhydrous powder). These powders are obtained by spray-drying aqueous mixtures of the water-soluble polymers and the organic silicon compound and may be used, for example, as hydraulic binders, as clay and coloring materials, for rendering bulk materials hydrophobic when diluted with water, and as binders for finely-divided inorganic or organic materials.
521241
Eck Herbert
Roth Michael
Bereskin & Parr Llp/s.e.n.c.r.l.,s.r.l.
Wacker-Chemie G.m.b.h.
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