Aqueous silica compositions for polishing silicon wafers

C - Chemistry – Metallurgy – 09 – G

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57/10, 57/23

C09G 1/02 (2006.01) H01L 21/302 (2006.01)

Patent

CA 1220634

ABSTRACT OF THE DISCLOSURE A composition useful in polishing silicon wafers and like materials which comprises an aqueous colloidal silica sol or gel and from 0.1-5% by weight based on the SiO2 content of the sol or gel of piperazine.

484591

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