Aquoeus coating composition based on low-solvent modified...

C - Chemistry – Metallurgy – 09 – D

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C09D 163/00 (2006.01) C08G 59/04 (2006.01) C08G 59/06 (2006.01) C08G 59/14 (2006.01) C09D 4/06 (2006.01) C09D 7/02 (2006.01) C09D 7/12 (2006.01) C09J 163/00 (2006.01)

Patent

CA 2186425

Aqueous low-solvent coating compositions comprising a modified epoxy resin dispersion comprising an epoxy resin which is prepared by condensation of one or more epoxide compounds having at least two epoxide groups per molecule with an aromatic polyol; a dispersant comprising a condensation product of an aliphatic polyol and an epoxide compound having at least two epoxide groups per molecule; a diluent consisting of ethylenically unsatu- rated otherwise inert or, if desired, functional monomers capable of free-radical polymerization or copolymeriza- tion, and water, and also an aqueous curing agent for the modified epoxy resin (I), which is suitable for curing at room temperature or at elevated temperatures (forced drying), components (I) and (II) being employed in proportions by mass such that the ratio of the number of epoxide groups which are capable of reaction to the number of amine hydrogen atoms is between 1:0.75 and 1:2. The coating compositions can be employed to produce matt coatings and in adhesives.

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