C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
400/4208, 402/52
C08K 5/42 (2006.01) C09D 3/48 (1985.01)
Patent
CA 1244598
Abstract of the Disclosure Curable compositions with improved humidity resistance are com- posed of an active hydrogen-containing resin which is essentially free of glycidyl groups, a curing agent present externally and/or internally as a part of the active hydrogen-containing resin, and a catalytic amount of a sulfonic acid having a molecular weight of less than 500 and represented by the following structural formula: Image wherein: Z is a radical independently selected from C1 to C20 alkyl, C3 to C20 cylcoalkyl, C6 to C18 aryl, halogen, alkoxy, hydroxyl, and aryloxy; is independently selected from hydrogen, C1 to C20 alkyl, C3 to C20 cycloalkyl and C6 to C18 aryl; y is an integer from 0 to 4; w is an integer from 0 to 2; x is an integer from 1 to 3, with the proviso that when w is 0, y is an integer from 1 to 4 and x is an integer from 2 to 3 and when y is 0, w is an integer from 1 to 2 and x is an integer from 1 to 2.
466141
Dowbenko Rostyslaw
Mccollum Gregory J.
O'dwyer James B.
Singer Debra L.
Borden Ladner Gervais Llp
Ppg Industries Ohio Inc.
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