Arrangement and method for improving vacuum in a very high...

H - Electricity – 01 – J

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H01J 7/18 (2006.01) B01J 3/00 (2006.01) B01J 23/46 (2006.01) C23C 14/56 (2006.01) C23C 16/44 (2006.01) C23C 28/02 (2006.01) H05H 7/14 (2006.01) C23C 14/16 (2006.01)

Patent

CA 2282664

The invention concerns an arrangement for improving vacuum in a very high vacuum system (ultrahigh vacuum) comprising a metal chamber releasing gas at its surface, consisting of a coating deposited on at least almost the whole surface of the metal wall defining the chamber. The invention is characterised in that the coating further comprises at least an undercoat of non-evaporating getter deposited on said surface of the metal wall defining the chamber and, on this undercoat, at least a thin film of at least a catalyst selected among ruthenium and/or rhodium and/or palladium and/or osmium and/or iridium and/or platinum and/or an alloy containing at least one of those.

Agencement permettant d'améliorer le vide dans un système à vide très poussé (ultravide) comprenant une enceinte métallique susceptible de relâcher du gaz à sa surface, consistant en un revêtement déposé sur au moins la quasi totalité de la surface de la paroi métallique définissant l'enceinte, caractérisé en ce que le revêtement comprend en outre au moins une sous-couche de getter non évaporable déposée sur ladite surface de la paroi métallique définissant l'enceinte et, sur cette sous-couche, au moins une couche mince d'au moins un catalyseur choisi parmi le ruthénium et/ou le rhodium et/ou le palladium et/ou l'osmium et/ou l'iridium et/ou le platine et/ou un alliage contenant au moins l'un de ceux-ci.

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