Arrangement for mounting dual-in-line packaged integrated...

Details Arrangement for mounting dual-in-line packaged integrated... Arrangement for mounting dual-in-line packaged integrated...

H - Electricity

01

L

356/127, 347/48

H01L 21/44 (2006.01) H05K 3/30 (2006.01) H05K 7/10 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1146283

TITLE AN ARRANGEMENT FOR MOUNTING DUAL-IN-LINE PACKAGED INTEGRATED CIRCUITS TO THICK/THIN FILM CIRCUITS ABSTRACT OF THE INVENTION An arrangement for mounting a dual-in-line packaged integrated circuit (DIP) to a thick/thin film circuit wherein a portion of each DIP lead is formed into a U-shape including a horizontal foot portion. The arrangement further includes a comple- mentary socket which accepts the U-shaped DIP leads in opposite sides thereof. The socket is then soldered to either a thick/thin film circuit of a circuit board.

366697

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