Article comprising improved noble metal-based alloys and...

Details Article comprising improved noble metal-based alloys and... Article comprising improved noble metal-based alloys and...

H - Electricity

01

R

H01R 13/02 (2006.01) B81C 1/00 (2006.01) H01B 1/02 (2006.01) H01H 1/023 (2006.01) H01H 1/00 (2006.01)

Patent

CA 2322714

A device having electrical contacts formed from an alloy having improved wear resistance is provided, the alloy being particularly useful in microrelay devices formed by MEMS technology. In one embodiment, the alloys are chosen to allow sufficient precipitation hardening to improve wear resistance, but keep precipitation below a level that would unacceptably reduce electrical conductivity. This is achieved by using alloying materials that have very limited or no solid solubility in the noble metal matrix, e.g., less than 4 wt.% solid solubility. In a second embodiment, an alloy contains a noble metal matrix and insoluble, dispersoid particles having no solubility in the matrix, these dispersoid particles offering a similar strengthening mechanism.

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