C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
400/1300, 167/25
C08K 5/05 (2006.01) C08J 3/14 (2006.01) C08L 23/08 (2006.01) C09J 5/00 (2006.01) C23F 13/02 (2006.01) F16L 58/04 (2006.01)
Patent
CA 1170390
A B S T R A C T Metal substrates such as pipes and pipelines are often protected from corrosion by providing the substrate with a protective cover that is bonded to the substrate by means of a sealant. In addition, a cathodic potential may be applied to the substrate to prevent loss of ions from the substrate due to electrochemical reactions. This can, however, lead to disbonding of the cover by a phenomenon known as "cathodic disbonding". Cathodic disbonding may be reduced according to the in- vention by incorporation in the sealant at least 0.01%, preferably at least 0.1% by weight of an organic, non- phenolic polyhydroxy compound, for example a mono- or polysaccharide, a synthetic hydroxy-containing polymer or a polyhydric alcohol. The sealant may be provided as a pre-coated layer on a cover for the substrate, preferably on a dimensionally heat-recoverable cover.
364263
Erbes-Mrsny Kathleen A.
Fritchle Elena C.
Pieslak George
Fetherstonhaugh & Co.
Raychem Corporation
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