C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
C25D 5/02 (2006.01) C25D 5/10 (2006.01)
Patent
CA 2286326
An electroplating method that includes: a) contacting a first substrate (2) with a first electroplating article (4), which includes a support and a conformable mask disposed in a pattern on the support; b) electroplating a first metal from an electroplating bath (58) which is a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. The method may be used in the microfabrication of miniaturized devices. Electroplating articles and electroplating apparatus are also disclosed.
On décrit un procédé d'électrodéposition qui consiste a) à mettre un premier substrat (2) au contact d'un premier article d'électrodéposition (4) incluant un support et un masque concordant disposé en motifs sur le support; b) à électroplaquer un premier métal extrait d'un bain électrolytique (58) constituant une source d'ions métalliques sur le premier substrat et dans un premier motif, ce dernier correspondant au complément du motif du masque concordant; et c) à enlever le premier article du premier substrat. Ledit procédé peut être mis en oeuvre pour la microfabrication d'appareils miniaturisés. On décrit en outre des articles d'électrodéposition et des appareils d'électrodéposition.
Mbm Intellectual Property Law Llp
University Of Southern California
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