H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/24 (2006.01) H05K 3/28 (2006.01)
Patent
CA 2662851
The invention relates to a coated article which has (i) at least one electrically non-conducting base layer, (ii) at least one layer of copper and/or a copper alloy, and (iii) a layer which contains at least one electrically conductive polymer, wherein the copper or copper alloy layer (ii) is positioned between the base layer (i) and the layer containing the conductive polymer (iii), and which is characterized in that the layer (iii) contains at least one precious metal or at least one semiprecious metal or a mixture thereof. The invention also relates to a process for its production and also its use for the prevention of corrosion and to preserve the solderability of printed circuit boards.
L'invention concerne un article revêtu comprenant : (i) au moins une couche de base non électro-conductrice, (ii) au moins une couche de cuivre et/ou un alliage de cuivre, et (iii) une couche contenant un polymère électro-conducteur, la couche de cuivre ou d'alliage de cuivre (ii) étant placée entre la couche de base (i) et la couche contenant le polymère conducteur (iii). L'article est caractérisé en ce que la couche (iii) contient au moins un métal précieux, un métal semi-précieux ou un mélange de ceux-ci. L'invention concerne également un procédé de production de l'article et son utilisation pour empêcher la corrosion et préserver l'aptitude au soudage à l'étain des cartes de circuits imprimés.
Bernhyard Wessling
Ormecon Gmbh
Ridout & Maybee Llp
LandOfFree
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