Artificial patina

Details Artificial patina Artificial patina

C - Chemistry, Metallurgy

09

D

C09D 1/00 (2006.01) C04B 22/14 (2006.01) C04B 28/00 (2006.01) C04B 28/26 (2006.01) C23C 8/40 (2006.01) C23C 22/52 (2006.01) C23C 22/68 (2006.01)

Patent

CA 2188661

The invention relates to an artificial patination formulation and method of coating a copper substrate with an artificial patina. The formulation comprises the reaction product of copper sulfate and optionally iron sulphate, with an inorganic hydroxide compound; and a suitable binder. The invention also relates to a method of coating a copper substrate with an artificial patina comprising contacting the copper substrate with a persulphate solution and then allowing the contacted surface to oxidize in a high humidity atmosphere.

L'invention concerne une formulation de patine artificielle et un procédé permettant d'enduire un substrat de cuivre avec cette patine. Cette formulation comprend le produit de réaction du sulfate de cuivre et, éventuellement, du sulfate de fer, avec un composé hydroxyde inorganique et elle comprend un liant approprié. L'invention concerne aussi un procédé, permettant d'enduire un substrat de cuivre avec une patine artificielle, qui consiste à mettre ce substrat de cuivre en contact avec une solution de persulfate puis à laisser la surface ainsi mise en contact s'oxyder dans une atmosphère fortement humide.

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