C - Chemistry – Metallurgy – 07 – D
Patent
C - Chemistry, Metallurgy
07
D
C07D 311/60 (2006.01) B32B 15/14 (2006.01) C07C 69/017 (2006.01) C07D 311/96 (2006.01) C08G 59/06 (2006.01) C08G 59/22 (2006.01) C08G 59/38 (2006.01) C08G 59/42 (2006.01) C08L 63/00 (2006.01) H01L 23/498 (2006.01) H05K 1/03 (2006.01)
Patent
CA 2157149
An aryl ester compound composed of a polyhydric phenol in which at least one OH group has been esterified with an organic acid or its derivatives having 1 to 20 carbon atoms, said polyhydric phenol being the condensation product of a phenolic compound represented by the general formula: Image with a carbonyl compound represented by the general for- mula: Image which aryl ester compound can give, when used as a curing agent for an epoxy resin, a cured product having a low dielectric constant and a low dielectric loss tangent; an epoxy resin composition comprising as the essential com- ponents an epoxy resin, said aryl ester compound and a cure accelerator; and a copper-clad laminate using the epoxy resin composition. The copper-clad laminate has a low dielectric constant and a low dielectric loss tangent and is excellent in adhesiveness as compared with conventional ones, and hence, is suitable for multilayer printed wiring board for high speed operation, especially at high-frequency region.
Endo Yasuhiro
Shibata Mitsuhiro
Ueda Youichi
Yamasaki Kaori
Fetherstonhaugh & Co.
Sumitomo Chemical Company Limited
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