Assemblies of substrates and electronic components

Details Assemblies of substrates and electronic components Assemblies of substrates and electronic components

H - Electricity

05

K

H05K 1/18 (2006.01) B23K 35/26 (2006.01) H05K 3/34 (2006.01) B23K 35/00 (2006.01)

Patent

CA 2214130

An assembly of a substrate and an electrical or electronic component, the component having electrically conductive leads with surfaces of an alloy of tin and copper and the leads being soldered to copper based terminals of the substrate by a solder alloy of tin and copper. Lead solder is thus avoided. Preferably each conductive lead has a surface layer of the alloy of tin and copper and core within the surface layer of another material which remains solid at the soldering temperature of the surface layer. Also included is a method of soldering a component with electrically conductive leads having surfaces of tin and copper alloy to copper based terminals by a solder alloy of tin and copper.

L'invention est un ensemble constitué par un substrat et un composant électrique ou électronique, ce composant ayant des conducteurs à surface en alliage d'étain et de cuivre qui sont soudés à des bornes à base de cuivre du substrat au moyen d'un alliage de soudure d'étain et de cuivre. On évite ainsi la soudure au plomb. Dans la concrétisation privilégiée de l'invention, chaque conducteur a une couche de surface en alliage d'étain et de cuivre et, sous cette couche de surface, une âme faite d'un autre matériau qui reste solide à la température de soudure de la couche de surface. Une méthode est également révélée pour souder à des bornes à base de cuivre, au moyen d'un alliage de soudure d'étain et de cuivre, un composant ayant des conducteurs électriques à surfaces en alliage d'étain et de cuivre.

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