Assembling module for floor or wall coverings

E - Fixed Constructions – 04 – F

Patent

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Details

E04F 15/10 (2006.01) E04F 13/18 (2006.01)

Patent

CA 2472152

The invention concerns a module characterized in that it comprises at least an associated two-layer structure, one first layer (C1) being a polymer base layer highly loaded with mineral fillers contributing to the rigidity of the module, and a second layer (C2) made from a printed polymer film defining the decorative part of the module, and the protection of the decorative part, said module being further characterized in that the outer surface of the rigidifying base layer is designed to form a spacer means (2) in the form of a plate of dimensions substantially greater than the format of the module, over all or part thereof, to constitute after abutment of the modules and/or edge jointing of the plate edges, a zone for receiving a sealant such as a binder, putty and like bonding.

Ce module est remarquable en ce qu'il comprend une structure au moins bi- couches associées ; une première couche (C1) étant une sous-couche en polymère fortement chargée en charges minérales contribuant ô la rigidité du module, et une second couche (C2) établie ô partir d'un film polymère imprimé définissant le décor du module, et la protection du décor, ledit module étant caractérisé en ce que la face externe de la sous-couche de rigidification est agencée pour constituer un moyen espaceur (2) sous forme d'une plaque de dimensions sensiblement supérieures au format du module, sur tout ou partie de celui-ci, pour constituer après mise ô bout des modules et/ou jointement bout ô bout des chants de la plaque, une zone de réception d'un jointement du type liant, mastic et similaires de liaison.

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