Assembly of an optical component and an optical waveguide

Details Assembly of an optical component and an optical waveguide Assembly of an optical component and an optical waveguide

G - Physics

02

B

G02B 6/42 (2006.01) H01S 5/022 (2006.01) H01S 5/02 (2006.01)

Patent

CA 2254996

An assembly of an optical component, e.g. a laser diode (1), and an optical waveguide (2), in alignment with each other on a silicon-on-insulator chip which comprises a layer of silicon (7) separated from a substrate (8) by a layer of insulating material (9). A location recess is formed in the chip to receive the laser diode (1). The recess has at least two non-parallel location surfaces (3, 6) and the waveguide is formed on the chip in known alignment with the location surfaces (3, 6). The laser diode (1) has at least two reference surfaces (1A, 1B) and is mounted in the location recess so that the reference surface (1A, 1B) abut against the respective location surfaces (3, 6). The location recess is formed such that the position of one (6) of its location surfaces is determined by the position of the upper or lower interface of the layer of insulating material (9) of the silicon-on-insulator chip.

Un ensemble constitué d'un composant optique, par exemple une diode laser (1), et d'un guide d'ondes optique (2), en alignement mutuel sur une puce silicium sur isolant, comprend une couche de silicium (7) séparée d'un substrat (8) par une couche de matériau isolant (9). Un évidement de localisation formé sur la puce reçoit la diode laser (1). L'évidement présente au moins deux surfaces de localisation non parallèles (3, 6) et le guide d'ondes est formé sur la puce selon un alignement connu avec les surfaces de localisation (3, 6). La diode laser (1), qui présente au moins deux surfaces de référence (1A, 1B), est fixée dans l'évidement de localisation de façon que ses surfaces de référence (1A, 1B) butent contre les surfaces de localisation correspondantes (3, 6). L'évidement de localisation est formé de façon que la position de l'une (6) de ses surfaces de localisation soit déterminée par la position de l'interface supérieure ou inférieure de la couche de matériau isolant (9) de la puce.

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