Atmospheric pressure chemical vapor deposition

C - Chemistry – Metallurgy – 23 – C

Patent

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C23C 16/453 (2006.01) C23C 16/06 (2006.01)

Patent

CA 2577304

A process for coating a substrate at atmospheric pressure comprises the steps of vaporizing a controlled mass of semiconductor material at substantially atmospheric pressure within a heated inert gas stream, to create a fluid mixture having a temperature above the condensation temperature of the semiconductor material, directing the fluid mixture at substantially atmospheric pressure onto the substrate having a temperature below the condensation temperature of the semiconductor material, and depositing a layer of the semiconductor material onto a surface of the substrate.

L'invention porte sur un procédé de revêtement d'un substrat à la pression atmosphérique. Ce procédé consiste à vaporiser une masse contrôlée de matériau semiconducteur sensiblement à la pression athmosphérique à l'intérieur d'un flux gazeux inerte chauffé afin de créer un mélange de fluides dont la température est supérieure à la température de condensation du matériau semiconducteur, à diriger le mélange de fluides sensiblement à la température atmosphérique sur le substrat dont la température est inférieure à la température de condensation du matériau semiconducteur, et à déposer une couche du matériau semiconducteur sur une surface du substrat.

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