Attachment of solder preform to a cover for a sealed container

Details Attachment of solder preform to a cover for a sealed container Attachment of solder preform to a cover for a sealed container

B - Operations, Transporting

23

K

113/80

B23K 1/14 (2006.01) B23K 35/02 (2006.01) H01L 21/50 (2006.01)

Patent

CA 1151011

ABSTRACT OF THE DISCLOSURE A method is described for attaching a preformed solder ring to a cover used to hermetically seal a container for a semiconductor device. The surface of the preformed solder ring that engages the cover is caused to melt and bond to the cover on solidification while the opposite surface of the ring is maintained relatively cool in a solid state by abutment against the flat surface of a cooling block.

377200

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